Ceramic substrates are widely used in various fields such as power electronics, electronic packaging, hybrid microelectronics, multi-chip modules, etc. due to their excellent thermal conductivity and air tightness. Among them, alumina ceramics are the most commonly used ceramic substrate material and are favored for their good overall performance. The advantages of alumina ceramic substrates include excellent insulation properties, excellent high-temperature resistance, high strength and hardness, excellent chemical stability, and good processing performance. They effectively isolate circuits, are resistant to high temperatures, resist chemical corrosion, and meet complex processing and high-precision dimensional requirements. The main applications of alumina ceramic substrates are as follows:
Ceramic Substrates for Chip Resistors
Alumina ceramic substrates for resistors have the advantages of small size, lightweight, low thermal expansion coefficient, high reliability, high thermal conductivity, and high density. They greatly improve the reliability and wiring density of the circuit, making them an ideal carrier material for chip resistor components.
Ceramic Substrates for Hybrid Integrated Circuits
Hybrid integrated circuits involve packaging multiple components, at least one of which is active. These complex circuits are created by mounting components on metal conductor insulator boards produced by thick film or thin film processes. Substrates provide mechanical support for circuits, serve as a deposition site for dielectric and resistor materials, and provide mechanical support for all passive and active chip components. Alumina, beryllium pillars, silicon dioxide, and aluminum nitride are commonly used substrates for hybrid integrated circuits. However, considering cost and performance, smooth-surfaced alumina substrates are widely used. The quality and grade of alumina substrates vary depending on the alumina content. Common choices include 99.6% alumina for thin-film circuits and 96% alumina for thick-film circuits. Multilayer co-fired alumina ceramics generally use alumina green boards with an alumina content ranging from 90% to 95% as the substrate.
Power Device Substrates
For packaging power electronic devices, substrates need to provide not only basic wiring (interconnection) functions, but also high thermal conductivity, insulation, heat resistance, pressure resistance, and thermal matching capabilities. Metal ceramic substrates such as DBC (direct bonding copper) and DPC (direct electroplated copper) have excellent performance in thermal conductivity, insulation, pressure resistance, and heat resistance. They have become the preferred material for power device packaging and are gradually gaining market recognition. The most common substrate material for device packaging is alumina (Al2O3), usually with an alumina content of 96%. Alumina substrate technology is mature and low-cost
Alumina ceramic substrate for LED
High-power LED heat dissipation substrates are mainly composed of ceramic substrates. The most commonly used high-power ceramic substrates on the market are LTCC (low-temperature co-fired ceramics) and DPC (direct electroplated copper). Ceramic materials such as alumina and aluminum nitride are used. Alumina ceramic substrates for LEDs have high heat dissipation and airtightness, which improves the luminous efficiency and life of LEDs. Its excellent airtightness also has high weather resistance, enabling it to be used in various environments.
specializes in the manufacture and sale of advanced ceramic parts. We provide customized production and high-precision processing for a variety of high-performance ceramic materials, including alumina ceramics, zirconium oxide ceramics, silicon nitride, silicon carbide, boron nitride, aluminum nitride, etc. Our ceramic parts can be found in many industries, such as machinery, chemistry, medicine, semiconductors, vehicles, electronics, metallurgy, etc.