Thick film circuits are a microelectronic integration technology based on ceramic substrates. The core of thick film circuits is to form circuit wiring, soldering areas, and resistor networks by screen printing thick film slurry (conductive/resistive materials) and sintering at high temperature. Finally, the chip mounting (SMT) and bonding processes are combined to integrate semiconductor chips and components to achieve high-density and high-reliability circuit functional modules. Commonly used ceramic sheets are aluminum nitride and aluminum oxide ceramics. Due to its superior performance, aluminum nitride ceramic sheets have shown a wide range of application potential in the field of thick film substrates and have become an important part of modern electronic packaging technology. The following is a detailed introduction to the application of aluminum nitride ceramic sheets in thick film substrates:
Advantages
1. High thermal conductivity: Aluminum nitride ceramic sheets have extremely high thermal conductivity and can effectively conduct heat away from the heat source, thereby reducing the operating temperature of the equipment and improving the stability and reliability of the equipment. In thick film substrates, this feature helps to quickly dissipate the heat generated by the circuit and prevent overheating from damaging electronic components.
2. Low dielectric constant: A lower dielectric constant can reduce delays and distortions during signal transmission and improve signal transmission speed and quality. This is especially important for high-frequency electronic devices, such as power amplifiers in 5G communication base stations. Using aluminum nitride ceramic sheets as thick film substrates can ensure efficient signal transmission.
3. Good chemical stability and insulation performance: Aluminum nitride ceramic sheets have good chemical stability, do not easily react chemically with other substances, and can maintain stable performance under harsh environmental conditions. At the same time, it also has excellent insulation properties, which can effectively isolate the current between electronic components, prevent problems such as short circuits, and ensure the normal operation of electronic equipment.
4. Thermal expansion coefficient matching silicon: The thermal expansion coefficient of aluminum nitride ceramic sheets is close to that of silicon, which enables it to better match semiconductor components such as silicon chips when the temperature changes, reducing component damage or performance degradation caused by thermal stress mismatch, improving the bonding reliability between thick film substrates and chips, and extending the service life of electronic equipment.
Application fields
1. Electronic packaging: In the field of electronic packaging, aluminum nitride ceramic sheets, as thick film substrates, provide stable support and electrical connections for various electronic components, and can also play a role in heat dissipation and protection. For example, in integrated circuit packaging, it can effectively improve the heat dissipation efficiency of the chip and ensure the normal operation of the chip; in power electronic module packaging, its high thermal conductivity can dissipate a large amount of heat in time, improving the power density and reliability of the module.
2. Aerospace: Due to the extremely high requirements for lightweight and high-performance materials in the aerospace field, thick film substrates made of aluminum nitride ceramic sheets have been widely used due to their excellent performance. For example, in satellite communication systems, it can be used to manufacture high-frequency, high-power RF device substrates to ensure stable signal transmission; in the electronic control system of aircraft engines, as a thick film substrate, it can withstand high temperature environments and ensure the reliable operation of the system.
3. New energy vehicles: Key components such as electronic control units and power converters in new energy vehicles require the use of high-reliability thick film substrates to achieve electrical connections and heat dissipation. Thick film substrates made of aluminum nitride ceramic sheets can meet the working requirements of these components in complex environments such as high pressure, high temperature, and high humidity, and improve the overall performance and safety of new energy vehicles.
In summary, the application of aluminum nitride ceramic sheets in the field of thick film substrates has significant advantages, which not only improve the performance and reliability of electronic equipment but also promote the rapid development of related industries. With the continuous advancement of science and technology, the application prospects of aluminum nitride ceramic sheets in the field of thick film substrates will be broader in the future.